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期刊論文
  1. C. D. Wu*, N. Y. Yeh, P. C. Cheng , “Effects of sp3 Bond Ratio and Modulation Ratios on Nanotribology behaviors of Diamond-Like Carbon Coatings Investigated Using Atomistic Nanoscratching Simulations” , 2024 , Journal of Molecular Modeling , vol.0 , p.0-0. (SCI期刊)
  2. C. D. Wu*, N. Y. Yeh , “Effects of sp3 Bond and Modulation Ratios on Ultra-thin Diamond-Like Carbon Coatings Using Molecular Dynamics Nanoindentation” , 2023 , Applied Physics A , vol.129 , p.839-1-8. (SCI期刊)
  3. 沈科帆, 吳政達* , “利用倒傳遞類神經網路和田口法預測分析放電加工行為” , 2023 , 先進工程學刊 , vol.0 , p.0-0.
  4. C. D. Wu*, G. W. Hong , “Atomistic Simulation of the Effect of Porosity on Shock Response of Nanoporous Gold” , 2023 , Journal of Molecular Modeling , vol.29 , p.173-1-9. (SCI期刊)
  5. C. D. Wu*, K. W. Liu, P. C. Cheng , “Atomistic Simulation of Mechanical Behavior of Cu/Cu3Sn Solder Interface With Kirkendall Void Under Shear and Tensile Deformation” , 2023 , Applied Physics A , vol.129 , p.255-1-10. (SCI期刊)
  6. C. D. Wu*, K. W. Liu , “Effects of Location and Size of Kirkendall Voids on Mechanical Response of Cu/Sn Solder Joint Under Tension” , 2023 , Molecular Simulation , vol.49 , p.885-892. (SCI期刊)
  7. C. D. Wu*, K. W. Liu , “Effects of Void and Temperature on Fracture of Cu/Cu3Sn Bilayers: A Molecular Dynamics Study” , 2022 , Materials Today Communications , vol.31 , p.103833-1-9. (SCI期刊)
  8. C. D. Wu*, G. W. Hong , “Effects of Heating Rate on Morphological Evolution, Microstructure, and Mechanical Properties of Nanoporous Gold” , 2022 , Journal of Applied Physcis , vol.131 , p.224304-1-9. (SCI期刊)
  9. C. D. Wu*, H. X. Li , “Atomistic Simulations of Improved Thermal Stability and Strength of Nanocrystalline Copper by Alloying with Zr” , 2022 , Thin solid films , vol.746 , p.139123-1-7. (Scopus期刊)(SCI期刊)
  10. C. D. Wu*, W. X. Xu , “Effects of Extrusion Ratio and Direction on Extruded Au Nanowires Investigated Using Molecular Dynamics Simulation” , 2021 , Journal of Physics Communications , vol.0 , p.0-0. (SCI期刊)
  11. C. D. Wu*, H. X. Li , “Atomistic simulations of effects of Zr solute and loading mode on mechanical behavior of nanocrystalline Cu” , 2021 , Journal of Applied Physics , vol.130 , p.075102-1-8. (SCI期刊)
  12. C. D. Wu, T. H. Fang*, Y. C. Wei , “Effects of Tool Rake Angle and Workpiece Surface Roughness on Nanocutting of Cu Investigated Using Multiscale Simulation” , 2021 , Molecular Simulatoin , vol.47 , p.1010-1016. (SCI期刊)
  13. C. D. Wu*, H. X. Li , “Molecular Dynamics Simulation of Stabilization and Strengthening of Nanocrystalline Cu alloyed with Zr” , 2021 , Materials Today Communications , vol.26 , p.101963-1-101963-6. (SCI期刊)
  14. 吳政達*、黃彥霖、葉國良 , “應用田口法於半導體真空迴焊技術之時間與溫度的優化” , 2021 , 先進工程學刊 , vol.16 , p.19-24.
  15. C. D. Wu*, B. W. Liao, Y. L. Chen, C. W. Pan, P. Y. Chen, P. L. Chan, S. T. Shih , “Molecular Dynamics Simulation of Effects of Microstructure and Loading Mode on Mechanical Properties of Au Nanowires” , 2020 , Molecular Simulatoin , vol.46 , p.1291-1297. (SCI期刊)
  16. C. D. Wu, T. H. Fang*, W. C. Su, Y. C. Fan , “Effects of Constituting Material and Interfacial Crack on Mechanical Response of Nanoscale Metallic Bilayers – A Quasi-continuum Study” , 2020 , Molecular Simulatoin , vol.46 , p.1155-1163. (SCI期刊)
  17. C. D. Wu*, Y. W. Cheng, G. W. Hong , “Mechanical Response of Nanoporous Nickel Investigated Using Molecular Dynamics Simulations” , 2020 , Journal of Molecular Modeling , vol.26 , p.185-1-7. (SCI期刊)
  18. C. D. Wu*, B. X. Huang, H. X. Li , “Effects of Interfacial Defect on Deformation and Mechanical Properties of Cu/Ni Bilayer - A Molecular Dynamics Study” , 2020 , Thin Solid Films , vol.707 , p.138050-1-6. (SCI期刊)
  19. C. D Wu*, R. E. Li , “Effects of Alloy Composition, Cavity Aspect Ratio, and Temperature of Imprinted ZrCu Metallic Glass Films: A Molecular Dynamics Study” , 2020 , Applied Physics A , vol.126 , p.209-209. (SCI期刊)
  20. C. D Wu, T. H. Fang*, W. C. Su , “Fracture and crack propagation of metallic bilayers using quasi-continunnm simulations” , 2020 , Digest Journal of Nanomaterials and Biostructures , vol.15 , p.319-327. (SCI期刊)
  21. C. D. Wu*, W. X. Xu , “Atomistic Analysis of Nanoextrusion Process for Fabrication of Gold Nanowires” , 2019 , Journal of Applied Physics , vol.126 , p.205104-205104. (SCI期刊)
  22. C. D Wu, T. H. Fang*, C. H. Chen , “Effects of Mold Pattern Characteristics on Nanoimprinted Aluminum Investigated Using Quasi-continuum Simulations” , 2019 , Engineering Research Express , vol.1 , p.015016-015016.
  23. C. D. Wu, T. H. Fang*, Y. J. Lin, Y. D. Jie , “Nanowelding of Nickel and Copper Investigated Using Quasi-continuum Simulations” , 2019 , Multiscale and Multidisciplinary Modeling, Experiments and Design , vol.2 , p.63-71.
  24. C. D. Wu, T. H. Fang*, K. C. Chao , “Effects of Temperature and Alloy Composition on Nanomechanical Properties of ZrCu Metallic Glass Under Tension” , 2019 , Current Nanoscience , vol.15 , p. 481-485. (SCI期刊)
  25. C. D. Wu, T. H. Fang*, Y. J. Lin , “Quasi-continuum Simulations of Side-to-side Nanowelding of Metals ” , 2018 , Journal of Molecular Modeling , vol.24 , p.222-230. (SCI期刊)
  26. C. D. Wu, W. X. Jiang , “Molecular Dynamics Study on Deformation and Mechanics of Nanoscale Au/Cu Multilayers under Indentation” , 2018 , Journal of Molecular Modeling , vol.24 , p.253-259. (SCI期刊)
  27. C. D. Wu*, C. W. Hsu , “Atomistic Simulation of Effects of Surface Notches and Loading Mode on Deformation and Mechanics of ZrNi Metallic Glass” , 2018 , AIP Advances , vol.8 , p.075325-1-075325-8. (SCI期刊)
  28. C. D. Wu*, H. W. Tsai , “Atomic Study of Effects of Crystal Structure and Temperature on Structural Evolution of Au Nanowires under Torsion” , 2018 , Journal of Applied Physics , vol.123 , p.214304-1-214304-7. (SCI期刊)
  29. C. D. Wu*, C. J. Hou , “Molecular Dynamics Analysis of Plastic Deformation and Mechanics of Imprinted Metallic Glass Films” , 2018 , Computational Materials Science. , vol.144 , p.248-255. (SCI期刊)
  30. C. D. Wu, T. H. Fang*, Y. J. Lin , “Quasi-continuum Simulations Solid-state Pressure Nanowelding of Metals” , 2018 , Current Nanoscience , vol.14 , p.179-186. (SCI期刊)
  31. 吳政達* , 洪韶陽 , “應用低溫滲碳法於316不銹鋼表面硬度提升” , 2018 , 先進工程學刊 , vol.0 , p.0-0.
  32. P. H. Sung, T. C. Chen, C. D. Wu* , “Atomistic Simulation of ZrNi Metallic Glasses Under Torsion Test” , 2017 , Nano , vol.12 , p.1750094-6. (SCI期刊)
  33. C. D. Wu*, H. W. Tsai , “Effect of Notch Radius on Nanocrystalline Au under Tensile Deformation at Low Temperature” , 2017 , Journal of Computational and Theoretical Nanoscience , vol.14 , p.4669-4673. (SCI期刊)
  34. C. D. Wu*, W. X. Jiang , “Atomistic Simulation of Effects of Temperature and Velocity on Tensile-deformed Au/Cu/Au/Cu Films” , 2017 , Thin Solid Films , vol.638 , p.258-263. (SCI期刊)
  35. C. D. Wu*, W. X. Jiang , “Molecular Dynamics Study of Uniaxial Tension of Au/Cu Multilayer Nanofilms” , 2017 , Journal of Computational and Theoretical Nanoscience , vol.14 , p.5151-5154. (SCI期刊)
  36. C. D. Wu, T. H. Fang*, F. Y. Tung , “Interface Friction of Double-walled Carbon Nanotubes Investigated Using Molecular Dynamics” , 2017 , MicroMechines , vol.8 , p.84-7. (SCI期刊)
  37. C. D. Wu*, H. W. Tsai , “Atomistic Simulation Study of Tensile Deformation in Nanocrystalline and Single-crystal Au” , 2017 , Journal of Molecular Modeling , vol.23 , p.114-06. (SCI期刊)
  38. C. D. Wu, T. H. Fang*, J. K. Su , “Nanometric Mechanical Cutting of Metallic Glass Investigated Using Atomistic Simulation” , 2017 , Applied Surface Science , vol.396 , p.319-326. (SCI期刊)
  39. C. D. Wu, T. H. Fang*, J. K. Su , “Mechanics and Pattern Transfer of Imprinted NiAl Amorphous Films Investigated Using Atomistic Simulation” , 2017 , Current Nanoscience , vol.0 , p.0-0. (SCI期刊)
  40. C. D. Wu* , “Molecular Dynamics Simulation of Nanotribology Properties of CuZr Metallic Glasses” , 2016 , Applied Physics A , vol.122 , p.486-1-486-7. (SCI期刊)
  41. C. D. Wu, T. H. Fang*, H. J. Wei , “Analysis of Welding Au Nanowires into T Junctions” , 2016 , Molecular Simulation , vol.42 , p.1029-1034. (SCI期刊)
  42. B. H. Liu, Q. C. Hsu, C. D. Wu* , “Nanoextruded NbTi Superconductor Nanowires Investigated Using Molecular Dynamics Simulations” , 2016 , Applied Physics A , vol.122 , p.465-1-465-7. (SCI期刊)
  43. C. D. Wu, T. H. Fang*, C. C. Wu , “Size Effect on Cold-welding of Gold Nanowires Investigated Using Molecular Dynamics Simulations” , 2016 , Applied Physics A , vol.122 , p.218-1-218-6. (SCI期刊)
  44. C. D. Wu*, H. Y. Liu , “Atomistic Analysis of Metallic Glass Nanowires and Nanofilms Under Compression” , 2016 , Journal of Computational and Theoretical Nanoscience , vol.13 , p.4384-4389. (SCI期刊)
  45. C. D. Wu, T. H. Fang*, C. C. Wu , “Effect of Temperature on Welding of Metallic Nanowires Investigated Using Molecular Dynamics Simulations” , 2016 , Molecular simulation , vol.2 , p.131-137. (SCI期刊)
  46. C. D. Wu* , “Study on Nanomechanical Response of Tensile-deformed Cu-Zr-Ti Metallic Glass Using Atomistic Simulation” , 2015 , Journal of Computational and Theoretical Nanoscience , vol.12 , p.4741-4746. (SCI期刊)
  47. C. D. Wu, T. H. Fang*, C. H. Kuo , “Nanomilling Mechanism on Cu Surfaces Investigated Using Atomistic Simulation” , 2015 , Molecular simulation , vol.14 , p.1159-1165. (SCI期刊)
  48. C. D. Wu* , “Atomistic Simulation of Nanoformed Metallic Glass” , 2015 , Applied Surface Science , p.153-159. (SCI期刊)
  49. C. D. Wu, T. H. Fang*, C. H. Kuo , “Atomistic Simulation of Nanodrilling Mechanics and Mechanism on Cu Substrates” , 2015 , Applied Physics A , vol.118 , p.307-313. (SCI期刊)
  50. C. D. Wu, T. H. Fang*, C. C. Wu , “Atomistic Simulations of Nanowelding of Single-crystal and Amorphous Gold Nanowires” , 2015 , Journal of Applied Physics , vol.117 , p.014307-1-6. (SCI期刊)
  51. C. D. Wu, T. H. Fang*, J. F. Lin , “Effects of Mold Geometry and Taper Angles on the Filling Mechanism of a Nanoimprinted Polymer Using Molecular Dynamics” , 2014 , Applied Surface Science , vol.316 , p.292-300. (SCI期刊)
  52. C. D. Wu, Y. J. Huang, T. H. Fang, J. F. Lin*, R. Lucio , “Molecular Dynamics Simulations on Cold Welding of Gold Nanowires” , 2014 , Journal of Nanoscience Letters , vol.4 , p.13-1-13-3. (EI期刊)
  53. C. D. Wu, T. H. Fang*, C. Y. Chen, C. I. Weng , “Effect of Nanograin Size on Nanoformed NiTi Alloys at Room Temperature” , 2014 , Applied Surface Science , vol.292 , p.500-505. (SCI期刊)
  54. C. D Wu, P. Y. Chang Chin, C. C. Chiang, R. J. Lai, T. H. Fang* , “Effect of Water Separation Layer on Metal Nanoforming Process Investigated Using Molecular Dynamics Simulations” , 2013 , Journal of Applied Physics , vol.114 , p.174303-1-174303-6. (SCI期刊)
  55. Y. C. Fan, C. D. Wu, T. H. Fang*, T. H. Chen , “Thermal relaxation and deformation of indented graphene” , 2013 , Computational Materials Science , vol.79 , p.105-109. (SCI期刊)
  56. C. D. Wu, T. H. Fang*, J. Y. Lo, Y. L. Feng , “Molecular dynamics simulations of hydrogen storage capacity of few-layer graphene” , 2013 , Journal of Molecular Modeling , vol.19 , p.3813-3819. (SCI期刊)
  57. C. D. Wu, T. H. Fang*, C. C. Chiang, L. M. Kuo , “Effect of Mold Geometry on Nanoformed Aluminum Films Investigated Using Molecular Dynamics Simulations” , 2013 , Computational Materials Science , vol.74 , p.17-22. (SCI期刊)
  58. C. D. Wu, P. H. Sung, T. H. Fang* , “Study of Deformation and Shape Recovery of NiTi Nanowires Under Torsion” , 2013 , Journal of Molecular Modeling , vol.19 , p.1883-1890. (SCI期刊)
  59. C. D. Wu, P. H. Sung, T. H. Fang* , “Effects of Crystal Orientation and Aspect Ratio on Plastic Response of Aluminum Nanowires Under Torsion” , 2013 , Molecular Simulation , vol.39 , p.596-601. (SCI期刊)
  60. C. D. Wu, T. H. Fang*, J. F. Lin , “Nanotribology of Self-assembled Monolayer under Tilt Contact with a Probe Tip Using Molecular Dynamics Simulations” , 2013 , Micron , vol.44 , p.410-418. (SCI期刊)
  61. C. D. Wu, T. H. Fang*, J. Y. Lo , “Effects of Pressure, Temperature, and Geometric Structure of Pillared Graphene on Hydrogen Storage Capacity” , 2012 , International Journal of Hydrogen Energy , vol.37 , p.14211-14216. (SCI期刊)
  62. C. D. Wu, T. H. Fang*, J. F. Lin , “Effects of Tip Gap, Deposition Temperature, Holding Time, and Pull-off Velocity on Dip-pen Lithography using Molecular Dynamics Simulation” , 2012 , Journal of Applied Physics , vol.111 , p.103521-1-103521-8. (SCI期刊)
  63. P. H. Sung, C. D. Wu, T. H. Fang* , “Effects of Temperature, Loading rate, and Nanowire Length on Torsional Deformation and Mechanical Properties of Aluminum Nanowires Investigated Using Molecular Dynamics Simulation” , 2012 , Journal of Physics D: Applied Physics , vol.45 , p.215303-1-215303-8. (SCI期刊)
  64. C. D. Wu, T. H Fang*, J. F. Lin , “Atomic-scale Simulations of Material Behaviors and Tribology Properties for FCC and BCC metal films” , 2012 , Materials Letters , vol.80 , p.59-62. (SCI期刊)
  65. P. H. Sung, C. D. Wu, T. H. Fang*, C. I. Weng , “Size Effect on Shape Recovery and Induced Strain of NiTi Nanowires” , 2012 , Applied Surface Science , vol.258 , p.7064-7069. (SCI期刊)
  66. S. J. Lin, C. D. Wu, T. H. Fang*, L. M. Kuo , “Effects of Layered Structure, Composition, and Annealing on Nanoformed Au-Cu Rods Using Molecular Dynamics Simulation” , 2012 , Computational Materials Science , vol.59 , p.114-120. (SCI期刊)
  67. S. J. Lin, C. D. Wu, T. H. Fang*, G. H. Chen , “Effects of Incident Cluster Size, Substrate Temperature, and Incident Energy on Bombardment of Ni Clusters onto Cu (001) Surface Studied Using Molecular Dynamics Simulation” , 2012 , Applied Surface Science , vol.258 , p.5892-5897. (SCI期刊)
  68. P. H. Sung, C. D. Wu, T. H. Fang* , “Investigation of Nanomechanical Properties of Al/Ni and Ni/Al Nanomultilayers Under Nanobending Using Molecular Dynamics Simulation” , 2012 , Computational Materials Science , vol.56 , p.43-48. (SCI期刊)
  69. T. H. Fang* , S. H. Kang, Z. H. Hong, C. D. Wu , “Elasticity and Nanomechanical Response of Aspergillus Niger Spores Using Atomic Force Microscopy” , 2012 , Micron , vol.43 , p.407-411. (SCI期刊)
  70. C. D. Wu, T. H. Fang*, Y. J. Huang, F. T. Weng , “Simulations of Deposition of Dip-pen Nanolithography and Annealing Characterizations of Patterns” , 2012 , Journal of Computational and Theoretical Nanoscience , vol.9 , p.1611-1617. (SCI期刊)
  71. Q. C. Hsu, Y. T. Lin, D. C. Chou, C. D. Wu* , “Study on Nanoimprint Formability Considered Anti-adhesion Layer for the (CH2)n Polymer Material by Molecular Dynamics Simulation” , 2012 , Current Nanoscience , vol.8 , p.424-431. (SCI期刊)
  72. C. D. Wu, T. H. Fang*, T. T. Wu , “Effects of Humidity and Temperature on Laser-assisted Dip-pen Nanolithography Array Studied Using Molecular Dynamics Simulations” , 2012 , Journal of Colloid and Interface Science , vol.372 , p.170-175. (SCI期刊)
  73. C. D. Wu, T. H. Fang*, T. T. Wu , “Study of Process Parameters and Formative Mechanism of Patterns on a Dip-pen Nanolithography Array Using Molecular Dynamics Simulations” , 2012 , Polymer , vol.53 , p.857-863. (SCI期刊)
  74. C. D. Wu, S. J. Lin, T. H. Fang*, Guan-Hung Chen , “Effects of Incidence Angle, Acceleration Energy, and Substrate Temperature on Sputtering of Cu Target Investigated Using Molecular Dynamics Simulation” , 2012 , Advanced Science, Engineering and Medicine , vol.4 , p.116-122. (EI期刊)
  75. T. H. Fang*, S. H. Kang, C. D. Wu, C. H. Chuang , “Thermoelectric Effect and Characterization of MgZnO and InZnO Nanorods” , 2012 , Journal of Advanced Microscopy Research , vol.7 , p.1-6. (EI期刊)
  76. Y. F. Chen, P. H. Sung, C. D. Wu, T. H. Fang* , “Studies of Nanomechanical Properties and Fatigue Strength of Annealed Ni-Ti Shape Memory Alloy” , 2012 , Materials Letters , vol.71 , p.84-87. (SCI期刊)
  77. C. D. Wu, T. H. Fang*, C. Y. Chan , “Molecular dynamics study of a cantilevered double-walled carbon nanotube nanomechanical resonator” , 2012 , Journal of Computational and Theoretical Nanoscience , vol.9 , p.72-76. (SCI期刊)
  78. Q. C. Hsu, J. J. Hsiao, T. L. Ho, C. D. Wu* , “Fabrication of Photonic Crystal Structures on Flexible Organic Light-Emitting Diodes Using Nanoimprint” , 2012 , Microelectronic Engineering , vol.91 , p.178-184. (SCI期刊)
  79. C. D. Wu, L. M. Kuo, S. J. Lin, T. H. Fang*, S. F. Hsieh , “Effects of Temperature, Size of Water Droplets, and Surface Roughness on Nanowetting Properties Investigated Using Molecular Dynamics Simulation” , 2012 , Computational Materials Science , vol.53 , p.25-30. (SCI期刊)
  80. C. D. Wu, T. H. Fang*, P. H. Sung, Q. C. Hsu , “Critical Size, Recovery, and Mechanical Property of Nanoimprinted Ni-Al alloys Investigation Using Molecular Dynamics Simulation” , 2012 , Computational Materials Science , vol.53 , p.321-328. (SCI期刊)
  81. Q. C. Hsu, C. L. Lin, C. D. Wu*, T. H. Fang , “Nanoimprint Lithography Simulation of the Polymer Chains (CH2)n with Anti-Adhesion Layer on Stamp by Molecular Dynamics Method” , 2012 , Journal of Computational and Theoretical Nanoscience , vol.9 , p.662-668. (SCI期刊)
  82. C. D. Wu and T. H. Fang* , “Simulation of Deposition of Ink Molecules on Rough Substrates in Dip-pen Nanolithography” , 2011 , Modeling and Simulation in Materials Science and Engineering , vol.19 , p. 065008-1- 065008-8. (SCI期刊)
  83. S. J. Lin, C. D. Wu, T. H. Fang*, L. M. Kuo , “Effects of Forging Temperature and Velocity on Nano-forming Process Using Molecular Dynamics Simulation” , 2011 , Computational Materials Science , vol.50 , p.2918-2924. (SCI期刊)
  84. S. J. Lin, C. D. Wu, T. H. Fang*, L. M. Kuo , “Effects of Surface Roughness on Nanojet Ejection Process Using Molecular Dynamics Simulation” , 2011 , Journal of Computational and Theoretical Nanoscience , vol.8 , p.1686-1693. (SCI期刊)
  85. C. D. Wu, T. H. Fang*, Y. J. Huang , “Effects of Non-Flat Contact and Interference on Self-Assembled Monolayers under Sliding Friction” , 2011 , Applied Surface Science , vol.257 , p.4123-4128. (SCI期刊)
  86. C. D. Wu, T. H. Fang*, C.Y. Chan , “A Molecular Dynamics Simulation of the Mechanical Characteristics of a C60-filled Carbon Nanotube under Nanoindentation Using Various Carbon Nanotube Tips” , 2011 , Carbon , vol.49 , p.2053-2061. (SCI期刊)
  87. C. D. Wu, T. H. Fang*, Y. J. Huang , “The Effects of Temperature and Scan Velocity on Direct-write Dip-pen Nanolithography Using Molecular Dynamics Simulation” , 2011 , Current Nanoscience , vol.7 , p.830-837. (SCI期刊)
  88. T. H. Fang*, C. D. Wu, S. H. Kang , “Thermomechanical Properties of Polymer Nanolithography Using Atomic Force Microscopy” , 2011 , Micron , vol.42 , p.492-497. (SCI期刊)
  89. C. D. Wu, T. H. Fang*, J. F. Lin , “Effect of chain length of self-assembled monolayers in dip-pen nanolithography using molecular dynamics simulations” , 2011 , Journal of Colloid and Interface Science , vol.361 , p.316-320. (SCI期刊)
  90. T. H. Fang*, S. H. Kang, C. D. Wu, W. J. Chang , “Surface and Nanomechanical Behavior of Human Molars Soaked in Sodium Fluoride” , 2011 , Journal of Advanced Microscopy Research , vol.6 , p.7-13. (EI期刊)
  91. C. D. Wu, J. F. Lin*, T. H. Fang , “Coarse Particle Dynamics Applied to the Nanocontact” , 2011 , IEEE Nanotechnology Magazine , vol.3 , p.9-15. (EI期刊)
  92. C. D. Wu, T. H. Fang*, J. F. Lin , “An Investigation of the Effects of PMMA Orientation and Antistiction Layer on the Nanoimprint Process Using Molecular Dynamics” , 2011 , Advanced Science Letters , vol.4 , p.36-43. (SCI期刊)
  93. C. D. Wu, T. H. Fang* and J. F. Lin , “Mechanical Characterization of Nanomolding Process Using Coarse Particle Dynamics” , 2010 , Journal of Computational and Theoretical Nanoscience , vol.7 , p.2171-2175. (SCI期刊)
  94. C. D. Wu, T. H. Fang*, J. F. Lin , “Formation Mechanism and Mechanics of Dip-pen Nanolithography Using Molecular Dynamics” , 2010 , Langmuir , vol.26 , p.3237-3241. (SCI期刊)
  95. J. F. Lin, T. H. Fang*, C. D. Wu, K. H. Houng , “Nanotribological Behavior of Diamond Surfaces Using Molecular Dynamics With Fractal Theory and Experiments” , 2010 , Current Applied Physics , vol.10 , p.266-271. (SCI期刊)
  96. T. H. Fang*, C. D. Wu, W. J. Chang, S. S. Chi , “Effect of thermal annealing on nanoimprinted Cu-Ni alloys using molecular dynamics simulation” , 2009 , Applied Surface Science , vol.255 , p.6043-6047. (SCI期刊)
  97. C. D. Wu, J. F. Lin* , T. H. Fang , “Molecular Dynamics Simulations of the Roller Nanoimprint Process: Adhesion and Other Mechanical Characteristics” , 2009 , Nanoscale Research Letters , vol.4 , p.913-920. (SCI期刊)
  98. C. D. Wu, J. F. Lin*, T. H. Fang, H. Y. Lin, S. H. Chang , “Multiscale Particle Dynamics on Nanocontact and Sliding Friction” , 2009 , Journal of Nanoscience and Nanotechnology , vol.9 , p.3295-3300. (SCI期刊)
  99. C. D. Wu, J. F. Lin*, T. H. Fang, H. Y. Lin, S. H. Chang , “Effects of a Self-assembled Monolayer on the Sliding Friction and Adhesion of an Au Surface” , 2008 , Applied Physics A , vol.91 , p.459-466. (SCI期刊)
  100. C. D. Wu and J. F. Lin* , “Multiscale Particle Dynamics on Nanoimprint Process” , 2008 , Applied Physics A , vol.91 , p.273-279. (SCI期刊)
  101. T. H. Fang*, W. J. Chang, C. D. Wu , “Effects of Temperature and Size on Contact Behavior of Self-assembled Alkanethiol Cluster for Dip-pen Nanolithography” , 2008 , Microelectronic Engineering , vol.85 , p.223-226. (SCI期刊)
  102. J. F. Lin, T. H. Fang*, C. D. Wu, K. H. Houng , “Contact and Frictional Behavior of Rough Surfaces Using Molecular Dynamics Combined with Fractal Theory” , 2007 , Computational Materials Science , vol.40 , p.480-484. (SCI期刊)
  103. T. H. Fang*, C. D. Wu, W. J. Chang , “Molecular Dynamics Analysis of Nanoimprinted Cu-Ni Alloys” , 2007 , Applied Surface Science , vol.253 , p.6953-6968. (SCI期刊)
  104. Q. C. Hsu*, C. D. Wu, T. H. Fang , “Effects of Critical Width and Draft Angle on Nanoimprint Process Using Molecular Dynamics” , 2006 , Journal of the Chinese Society of Mechanical Engineers , vol.27 , p.851-858. (EI期刊)
  105. C. D. Wu, J. F. Lin*, T. H. Fang , “Molecular Dynamic Simulation and Characterization of Self-assembled Monolayer under Sliding Friction” , 2006 , Computational Materials Science , vol.39 , p.808-816. (SCI期刊)
  106. Q. C. Hsu*, C. D. Wu, K. H. Yang, R. S. Lee , “Studies on Micro-forming of CuNi and ZnAl Alloy” , 2005 , Journal of the Chinese Society of Mechanical Engineers , vol.26 , p.591-596. (EI期刊)
  107. Q. C. Hsu*, C. D. Wu, T. H. Fang , “Studies on Nanoimprint Process Parameters of Copper by Molecular Dynamics Analysis” , 2005 , Computational Materials Science , vol.34 , p.314-322. (SCI期刊)
  108. Q. C. Hsu*, C. D. Wu, T. H. Fang , “Deformation Mechanism and Punch Taper Effects on Nanoimprint Processes by Molecular Dynamics” , 2004 , Japanese Journal of Applied Physics , vol.43 , p.7665-7669. (SCI期刊)
研討會論文
  1. C. D. Wu*, K. W. Liu , “Molecular Dynamics Simulation of Mechanical Behavior of CuSn Solder Interface Considering Kirkendall Voids” , 2023 , 2023 7th International Conference on Materials Engineering and Nano Sciences , 2023 /4 /7 ~ 2023 /4 /10 , Japan .
  2. 張育瑋、廖建富*、吳政達 , “以分子動力學模擬3D IC封裝之奈米雙晶銅焊接與機械性質分析” , 2022 , 2022 國際製造工程研討會暨產業論壇 , 2022 /11 /5 ~ 2022 /11 /5 , 中華民國 台灣 .
  3. 吳政達*、劉鎧瑋 , “運用分子動力學法分析IC封裝中Cu/Cu3Sn 焊點的機械行為” , 2022 , 中華民國力學學會第四十六屆全國力學會議(CTAM 2022) , 2022 /11 /18 ~ 2022 /11 /19 , 中華民國 台灣 .
  4. Cheng-Da Wu*, Bo-Xun Huang , “Molecular Dynamics Study of Deformation and Mechanical Properties of Cu/Ni Bilayer with Interfacial Defect ” , 2020 , The 3rd International Conference on Materials Engineering and Applications (ICMEA 2020) , 2020 /1 /6 ~ 2020 /1 /8 , Socialist Republic of Vietnam .
  5. Cheng-Da Wu, Te-Hua Fang*, Kuan-Chi Chao , “Effects of Temperature and Alloy Composition on Nanomechanical Properties of ZrCu Metallic Glass Under Tension” , 2016 , ICASI 2016 , 2016 /5 /28 ~ 2016 /6 /1 , Japan .
  6. Yu-Jen Hsiao; Te-Hua Fang; Cheng-Da Wu; Shi-Hao Wang; Bo-Yi Yang , “Structure and Synthesis of Bi2S3 Nanocrystals for Thermoelectric Device” , 2014 , ECS 226th Meeting , 2014 /10 /5 ~ 2014 /10 /9 , Mexico .
部分專書
  1. C. D. Wu, T. H. Fang, J. F. Lin , 編著者 , “Computational Simulations of Nanoindentation and Nanoscratch” , Computational Nanotechnology: Modeling and Applications with MATLAB , Crc Pr I Llc , 2011 , 978-1-43984-176-1 .
  2. C. D. Wu, T. H. Fang, J. F. Lin , 編著者 , “Nanomechanics and Nanotribological Characterization of Self-Assembled Monolayers for Nanosystems” , Advances in Nanotechnology , Nova Science Publishers , 2009 , 978-1-60741-731-6 .